16层三阶HDI

16层交叉盲埋孔 AnylayerHDI，FR-4，TG150，铜厚1OZ，树脂塞孔+电镀填平，阻抗±10%，小线宽线距3/4mil,沉金，绿油

layer HDI4-stage blind buried VAI hole, ISOLA+FR-4+TG180,military products,HDI Printed Circuit Boards,hdi pcb

Product Description

1. Product structure: 36-layer HDI4-stage blind buried VAI hole, ISOLA+FR-4+TG180, high-frequency mixed pressure, laser hole 0.10mm, copper hole filling, inner and outer copper thickness 70um, hole copper 25um, impedance ±10%, board 4.5mm thick, Immersion gold 2u'
2. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB
3. Standard.
4. Quantities range from prototype to volume production.
5. 100% E-Test
   Printed circuit board (pcb) and PCBA product areas
   Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
6. Winding circuit board (fpc) and FPCA product areas
   CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.